Method for reducing anti-reflective coating layer removal during removal of photoresist
A method and system for providing a semiconductor device. The semiconductor device includes a first layer to be etched. The method and system include depositing an anti-reflective coating. At least a portion of the anti-reflective coating layer is on the first layer. The method and system also inclu...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
21.03.2006
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Online Access | Get full text |
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Summary: | A method and system for providing a semiconductor device. The semiconductor device includes a first layer to be etched. The method and system include depositing an anti-reflective coating. At least a portion of the anti-reflective coating layer is on the first layer. The method and system also include patterning a resist layer. The resist layer includes a pattern having a plurality of apertures therein. The resist layer is for etching the first layer. A first portion of the first layer and a second portion of the anti-reflective coating layer are exposed by the pattern. The method and system also include etching the first portion of the first layer and the second portion of the anti-reflective coating layer and removing the resist layer utilizing a plasma etch. The anti-reflective coating layer is resistant to the plasma etch. |
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