Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix tha...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
21.03.2006
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Online Access | Get full text |
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Summary: | A semiconductor device having a thermoset-containing, dielectric material and methods for fabricating the same is provided. The device may take the form of a printed circuit board, an integrated circuit chip carrier, or the like. The dielectric material is a non-fibrillated, fluoropolymer matrix that has inorganic particles distributed therein and is impregnated with a thermoset material. |
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