Controlled fracture substrate singulation

Methods and apparatus for separating dice from a substrate are described herein.

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Bibliographic Details
Main Authors Chin, Oi Fong, Cheong, Yew Wee, Mong, Weng Khoon
Format Patent
LanguageEnglish
Published 28.02.2006
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Summary:Methods and apparatus for separating dice from a substrate are described herein.