CMP method and device capable of avoiding slurry residues

A method for chemical mechanical polishing (CMP) includes a rinsing process performed to clean an orifice of a slurry supplier and other elements of a CMP device. The CMP device includes least one nozzle disposed in the periphery of a base. The function of the nozzle is to spray DI water to the orif...

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Bibliographic Details
Main Authors Teng, Ching-Wen, Kao, Ming-Hsing, Lin, Chin-Kun, Chua, Er-Yang, Lau, Lee-Lee
Format Patent
LanguageEnglish
Published 28.02.2006
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Summary:A method for chemical mechanical polishing (CMP) includes a rinsing process performed to clean an orifice of a slurry supplier and other elements of a CMP device. The CMP device includes least one nozzle disposed in the periphery of a base. The function of the nozzle is to spray DI water to the orifice of the slurry supplier so as to prevent slurry residue and clogging.