Method for dual-layer polyimide processing on bumping technology

34 A new method and processing sequence is provided for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE SiNand a patterned layer of polyamide insulator. The patterned nega...

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Bibliographic Details
Main Authors Fan, Fu-Jier, Chu, Cheng-Yu, Lin, Kuo Wei, Lin, Shih-Jang, Fran, Yang-Tung, Peng, Chiou-Shian
Format Patent
LanguageEnglish
Published 25.10.2005
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Summary:34 A new method and processing sequence is provided for the formation of solder bumps that are in contact with underlying aluminum contact pads. A patterned layer of negative photoresist is interposed between a patterned layer of PE SiNand a patterned layer of polyamide insulator. The patterned negative photoresist partially overlays the aluminum contact pad and prevents contact between the layer of polyamide insulator and the aluminum contact pad. By forming this barrier no moisture that is contained in the polyamide insulator can come in contact with the aluminum contact pad, therefore no corrosion in the surface of the aluminum contact pad can occur.