Porous material air bearing platen for chemical mechanical planarization
A platen for use in chemical mechanical planarization (CMP) systems includes a platen plate that has at least one recess defined therein. The at least one recess has an input port formed therein. A porous material is disposed in the at least one recess. The porous material has a porosity sufficient...
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Main Author | |
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Format | Patent |
Language | English |
Published |
06.09.2005
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Online Access | Get full text |
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Summary: | A platen for use in chemical mechanical planarization (CMP) systems includes a platen plate that has at least one recess defined therein. The at least one recess has an input port formed therein. A porous material is disposed in the at least one recess. The porous material has a porosity sufficient to restrict air flow therethrough so as to reduce an amount of air required for a CMP operation. |
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