Method for manufacturing surface acoustic wave device

Provided is a method of manufacturing surface acoustic wave (SAW) devices having a first conductive pattern and a second conductive pattern of different thicknesses on one piezoelectric substrate. Combination of a plurality of steps of forming metal films and etching steps allows accurate production...

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Bibliographic Details
Main Authors Yamashita, Kiyoharu, Ikeda, Kazuo, Seki, Shunichi, Furukawa, Mitsuhiro
Format Patent
LanguageEnglish
Published 15.02.2005
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Summary:Provided is a method of manufacturing surface acoustic wave (SAW) devices having a first conductive pattern and a second conductive pattern of different thicknesses on one piezoelectric substrate. Combination of a plurality of steps of forming metal films and etching steps allows accurate production of SAW devices having a plurality of electrodes of different thicknesses on one piezoelectric substrate.