Low thermal resistance interface for attachment of thermal materials to a processor die
The embodiments disclosed herein relate to electronic devices and more particularly to the dissipation of heat generated by microprocessors. A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
14.12.2004
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Online Access | Get full text |
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