Low thermal resistance interface for attachment of thermal materials to a processor die

The embodiments disclosed herein relate to electronic devices and more particularly to the dissipation of heat generated by microprocessors. A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.

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Bibliographic Details
Main Authors Bhatia, Rakesh, DiStefano, Eric
Format Patent
LanguageEnglish
Published 14.12.2004
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Summary:The embodiments disclosed herein relate to electronic devices and more particularly to the dissipation of heat generated by microprocessors. A heat sink comprises a side including a structural member defining a distance between a heat generating structure and the second side of the heat sink.