Thermal management with filled polymeric polishing pads and applications therefor
The present invention is directed, to polishing pads used for creating a smooth, ultra-flat surface on such items as glass, semiconductors, dielectric/metal composites, magnetic mass storage media and integrated circuits. More specifically, the present invention relates to the transformation of ther...
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| Main Authors | , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
16.11.2004
|
| Online Access | Get full text |
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