Thermal management with filled polymeric polishing pads and applications therefor
The present invention is directed, to polishing pads used for creating a smooth, ultra-flat surface on such items as glass, semiconductors, dielectric/metal composites, magnetic mass storage media and integrated circuits. More specifically, the present invention relates to the transformation of ther...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
16.11.2004
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| Online Access | Get full text |
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| Summary: | The present invention is directed, to polishing pads used for creating a smooth, ultra-flat surface on such items as glass, semiconductors, dielectric/metal composites, magnetic mass storage media and integrated circuits. More specifically, the present invention relates to the transformation of thermal conductive properties to create more suitable polishing pads.
The present invention is directed, in general, to a method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polishing pads to improve thermal management during chemical-mechanical planarization, the resulting heat conductive pad and a polishing apparatus that includes the pad. The pad includes a polishing body composed of a thermoconductive polymer comprising an substrate and filler particle containing a Group II salt and within the substrate. |
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