Frit material and bonding method for microfluidic separation devices
The present invention relates to frit materials for use in microfluidic devices. A frit for use in multi-layer microfluidic separation devices is provided. The frit comprises a polymeric membrane that may be securely bonded within the device and minimizes lateral wicking. A secure bond is ensured by...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
09.11.2004
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| Online Access | Get full text |
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| Summary: | The present invention relates to frit materials for use in microfluidic devices.
A frit for use in multi-layer microfluidic separation devices is provided. The frit comprises a polymeric membrane that may be securely bonded within the device and minimizes lateral wicking. A secure bond is ensured by treating the polymer to match its surface energy to that of the materials to which it is bound. Treatments include plasma treatment, irradiation and the application of acids. |
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