Heat dissipation device having a load centering mechanism

1. Field of the Invention A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a cent...

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Bibliographic Details
Main Authors Winkel, Casey R, Eckblad, Michael Z, Sopko, Jeffrey J
Format Patent
LanguageEnglish
Published 12.10.2004
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Summary:1. Field of the Invention A heat dissipation device having an integral load centering mechanism adapted to provide a location for contact between a spring clip and the heat dissipation device. The load centering mechanism is located in an area on the heat dissipation device which will provide a centered loading to a microelectronic die and constitutes substantially the only place where the spring clip contacts the heat dissipation device when the spring clip is providing a force against the heat dissipation device.