Method and apparatus for wet-cleaning substrate

This application claims priority to Japanese Patent Application No. JP 2000-341094, JP 2000-341093, JP 2000-341092, JP 2000-363155, JP 2000-369632, and the disclosure of these applications are incorporated herein by reference to the extent permitted by law. In the art of wet-cleaning a substrate by...

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Bibliographic Details
Main Author Inagaki, Yasuhito
Format Patent
LanguageEnglish
Published 05.10.2004
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Summary:This application claims priority to Japanese Patent Application No. JP 2000-341094, JP 2000-341093, JP 2000-341092, JP 2000-363155, JP 2000-369632, and the disclosure of these applications are incorporated herein by reference to the extent permitted by law. In the art of wet-cleaning a substrate by etching with a cleaning solution prepared by dissolving hydrofluoric acid as an active component in water, using the process of measuring the concentration of a predetermined component regularly and then replenishing the cleaning solution with a component for correcting the concentration at need on the basis of the result of measurement on the concentration in case of cleaning the substrate with an aqueous solution of ammonium fluoride as the cleaning solution while controlling air in a cleaning draft at an exhaust rate within a predetermined range.