Epoxy washer for retention of inverted SMT components
The present invention relates generally to printed circuit board assembly and, more particularly, to an apparatus and method to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the dou...
Saved in:
| Main Authors | , , , |
|---|---|
| Format | Patent |
| Language | English |
| Published |
14.09.2004
|
| Online Access | Get full text |
Cover
Loading…
| Summary: | The present invention relates generally to printed circuit board assembly and, more particularly, to an apparatus and method to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board.
An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed. |
|---|