High modulus filler for low k materials

• Main Authors: Lyons, Christopher F, Rangarajan, Bharath
• Format: Patent
• Language: English
• Published: 14.09.2004

The present invention generally relates to processing low k materials on a semiconductor substrate. In particular, the present invention relates to methods of making and chemical mechanical polishing a low k material layer containing a high modulus filler. Disclosed are methods for processing a low k material involving providing a low k material layer comprising one or more low k polymer materials and one or more high modulus fillers on a semiconductor substrate, and chemical mechanical polishing the low k material layer so as to remove a portion of the low k material layer from the semiconductor substrate without substantially damaging unremoved portions of the low k material layer. In this connection, low k material layers for a semiconductor structure containing one or more low k polymer materials and one or more high modulus fillers are disclosed, as well as methods of making the low k material layers.