Power distribution architecture for inkjet heater chip
The present invention is generally directed to inkjet printers. More particularly, the invention is directed to an improved inkjet heater chip architecture wherein a single layer of metallization is used for the interconnecting circuitry. A heater chip for use in an inkjet printer which includes a s...
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| Format | Patent |
| Language | English |
| Published |
07.09.2004
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| Online Access | Get full text |
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| Summary: | The present invention is generally directed to inkjet printers. More particularly, the invention is directed to an improved inkjet heater chip architecture wherein a single layer of metallization is used for the interconnecting circuitry.
A heater chip for use in an inkjet printer which includes a single conductive layer to provide electrical connectivity between power and ground inputs. Wherein the unique power distribution architecture is possible by the formation of a plurality of ink vias in the heater chip which provides for an increase in the chip surface area available for electrical connectivity. |
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