Characteristic impedance equalizer and an integrated circuit package employing the same
The present invention is directed, in general, to integrated circuit packaging and, more specifically, to a characteristic impedance equalizer and an integrated circuit package employing the same. The present invention provides a characteristic impedance equalizer and method of manufacture thereof f...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
06.07.2004
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| Online Access | Get full text |
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| Summary: | The present invention is directed, in general, to integrated circuit packaging and, more specifically, to a characteristic impedance equalizer and an integrated circuit package employing the same.
The present invention provides a characteristic impedance equalizer and method of manufacture thereof for use with an integrated circuit package having first and second signal transmission zones. In one embodiment, the characteristic impedancs equalizer includes a first conductor having a first width and providing a characteristic impedance within the first signal transmission zone. The characteristic impedance equalizer also includes a second conductor, coupled to the first conductor, having a second width and providing substantially the same characteristic impedance within the second signal transmission zone. |
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