Polishing head assembly in an apparatus for chemical mechanical planarization

• Main Authors: Pham, Xuyen, de la Llera, Anthony
• Format: Patent
• Language: English
• Published: 08.06.2004

The present invention relates to a polishing head assembly for use in an apparatus for the chemical mechanical planarization (CMP) of surfaces such as semiconductor wafers. A polishing head assembly for use in a chemical mechanical planarization apparatus is provided. The polishing head assembly includes a carrier head shaped substantially like a disk having a circumference, a top surface, a bottom surface, and an outer wall, the outer wall having a groove therein, the groove extending into the carrier head from the bottom surface of the carrier head, and the groove running the entire circumference of the carrier head; and a retainer ring having an interior wall and an exterior wall, the interior wall of the retainer ring being in contact with the outer wall of the carrier head, the interior wall having a slot therein, the slot defining a lower portion of the interior wall as a flexible leg, the flexible leg having a receiving end that is adapted to secure an object having a surface to be polished, the slot having a first terminal end adjacent to the groove in the carrier head and a second terminal end, opposite the first terminal end, in the body of the retainer ring. A carrier head is provided, as is a retainer ring. A method of compensating for uneven force distribution in a chemical mechanical planarization apparatus is also provided.