Semi-conductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same
The present invention relates to a semiconductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same. The semiconductor apparatus is, for example, a tape carrier in a belt form on which a plurality of semiconductor devices flexible and bendable are...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
25.05.2004
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| Online Access | Get full text |
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| Summary: | The present invention relates to a semiconductor apparatus, a method of fabrication of the same, and a reinforcing tape used in fabrication of the same. The semiconductor apparatus is, for example, a tape carrier in a belt form on which a plurality of semiconductor devices flexible and bendable are provided in a lengthwise direction.
A semiconductor apparatus includes a thin film belt-like insulating tape having a plurality of predetermined wire patterns thereon, and a plurality of IC chips that are provided on a surface of the insulating tape at uniform spaces in a lengthwise direction and electrically connected with the wire patterns, and further includes thick film reinforcing tapes with sprocket holes for transport use provided at uniform spaces, the reinforcing tapes being provided on both side portions of the insulating tape, in the lengthwise direction. |
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