Die attachment with reduced adhesive bleed-out
The present invention is concerned with adhesively bonding a die to an organic chip carrier, and is especially concerned with significantly reducing, if not entirely eliminating, the problem of adhesive bleed-out. The present invention is concerned with adhesively bonding a die to an organic chip ca...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
11.05.2004
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| Online Access | Get full text |
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| Summary: | The present invention is concerned with adhesively bonding a die to an organic chip carrier, and is especially concerned with significantly reducing, if not entirely eliminating, the problem of adhesive bleed-out. The present invention is concerned with adhesively bonding a die to an organic chip carrier along with assuring that the metallic surface on the chip carrier remains wire bondable. The present invention provides for reducing die attach adhesive separation and thereby reducing contamination and/or staining of substrate surfaces due to the adhesive. The present invention also relates to adhesive compositions that exhibit reduced bleed-out.
An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads. |
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