Device and process for producing a soldered joint between two joining partners which can be by means of a common contact surface

The invention relates to a device and process for producing a soldered joint between two joining partners which can be joined via a common contact surface, using a solder material which can be introduced between the two joining partners. A device for producing a soldered joint between two joining pa...

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Bibliographic Details
Main Authors Benedetti, Bruno, Nagler, Christoph, Stengele, Joerg
Format Patent
LanguageEnglish
Published 11.05.2004
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Summary:The invention relates to a device and process for producing a soldered joint between two joining partners which can be joined via a common contact surface, using a solder material which can be introduced between the two joining partners. A device for producing a soldered joint between two joining partners which can be joined via a common contact surface (), using a solder material which can be introduced between the two joining partners. At least one joining partner (), in the region of the contact surface (), provides at least one recess, known as a solder reservoir (), which faces the contact surface and into which the solder material can be introduced, and the solder reservoir () is completely delimited and surrounded by the contact surface ().