Electronic device processing equipment having contact gasket between chamber parts

• Main Authors: Golovato, Stephen N, Laflamme, Jr., Arthur H, Wallace, Jay R
• Format: Patent
• Language: English
• Published: 24.02.2004

The invention relates to processing equipment, and particularly to an arrangement which provides advantageous thermal and/or electrical contact between chamber parts inside of the processing equipment. In an illustrated embodiment, a wedge ring assembly couples a chamber liner of with a chamber wall in a semiconductor processing apparatus, so that the temperature of the liner more closely matches that of the chamber wall. The invention can also have applications to processing equipment other than semiconductor processing equipment, e.g., equipment utilized in manufacturing components for liquid crystal displays. An arrangement for improved thermal and/or electrical coupling between parts disposed in electronic device processing equipment is provided. In an illustrated embodiment, an improved coupling between a chamber liner and a chamber wall is provided which can be utilized in semiconductor processing equipment. The arrangement includes a compressible coupling or gasket which is compressed between a wedge ring and the chamber wall. The chamber liner is coupled to the wedge ring, so that the chamber liner is coupled to the chamber wall by way of the wedge ring and compressible coupling.