Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques

This application is related to concurrently filed and commonly assigned patent application No. 10/430/942; filed May 6, 2003, entitled "MULTISTEP CURE TECHNIQUE FOR SPIN-ON-GLASS FILMS," having Zhenjiang Cui, Rick J. Roberts, Michael S. Cox, Jun Zhao, Khaled Elsheref and Alex Demos listed...

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Bibliographic Details
Main Authors Cui, Zhenjiang, Roberts, Rick J, Cox, Michael S, Zhao, Jun
Format Patent
LanguageEnglish
Published 17.02.2004
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Summary:This application is related to concurrently filed and commonly assigned patent application No. 10/430/942; filed May 6, 2003, entitled "MULTISTEP CURE TECHNIQUE FOR SPIN-ON-GLASS FILMS," having Zhenjiang Cui, Rick J. Roberts, Michael S. Cox, Jun Zhao, Khaled Elsheref and Alex Demos listed as co inventors. The 10/430,942 application is assigned to Applied Materials Inc., the assignee of the present invention, and is hereby incorporated by reference. A method of filling a plurality of trenches etched in a substrate. In one embodiment the method includes depositing a layer of spin-on glass material over the substrate and into the plurality of trenches; exposing the layer of spin-on glass material to a solvent; curing the layer of spin-on glass material; and depositing a layer of silica glass over the cured spin-on glass layer using a chemical vapor deposition technique.