Tamper-responding encapsulated enclosure having flexible protective mesh structure

1. Field of the Invention A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includ...

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Bibliographic Details
Main Authors Farquhar, Donald S, Feger, Claudius, Markovich, Voya, Papathomas, Konstantinos I, Poliks, Mark D, Shaw, Jane M, Szeparowycz, George, Weingart, Steve H
Format Patent
LanguageEnglish
Published 03.02.2004
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Summary:1. Field of the Invention A structure and method for forming a tamper respondent electronic circuit enclosure that includes an integrated circuit structure, a mesh structure surrounding the integrated circuit structure, and a sealed enclosure surrounding the mesh structure. The mesh structure includes a layer of flexible dielectric having a first side and a second side, a screen-printed pattern of flexible electrically conductive first circuit lines forming a first resistor network on the first side, and a photo lithographically-formed pattern of flexible electrically conductive second circuit lines forming a second resistor network on the second side.