Methods and apparatus for surface analysis

This invention relates to surface measurement, particularly of patterned surfaces to analyze surface characteristics of a patterned workpiece under study. There is described method and apparatus to create multi-dimensional non-spatial histograms of surfaces and to compare such histograms to show whe...

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Bibliographic Details
Main Authors Vurens, Gerard H, Klein, David L
Format Patent
LanguageEnglish
Published 13.01.2004
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Summary:This invention relates to surface measurement, particularly of patterned surfaces to analyze surface characteristics of a patterned workpiece under study. There is described method and apparatus to create multi-dimensional non-spatial histograms of surfaces and to compare such histograms to show whether the surfaces substantially conform to one another. This analysis is particularly applicable to comparing die on wafers to determine whether manufactured devices conform to a master or whether one die is like another.