Package for electronic component

The invention relates generally to electronic component packages and particularly to those which utilize an encapsulant. Even more particularly the invention relates to substrate packages for preventing cracks within the encapsulant from severing a conductive path therein. An electronic component su...

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Bibliographic Details
Main Authors Carey, Charles F, Johnson, Eric A, Migliore, Alfredo
Format Patent
LanguageEnglish
Published 13.01.2004
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Summary:The invention relates generally to electronic component packages and particularly to those which utilize an encapsulant. Even more particularly the invention relates to substrate packages for preventing cracks within the encapsulant from severing a conductive path therein. An electronic component such as a ceramic capacitor is coupled to a dielectric substrate package. Encapsulant material substantially surrounding the sides of the component, develops cracks therein, particularly near the corners of the component where CTE stresses are greatest. The cracks propagate downward into the dielectric substrate material and sever circuit lines in the substrate causing failure. A mounting pad for the component is extended from beneath the component to substantially beyond the outer periphery of the encapsulant material to prevent cracks from propagating into the dielectric material.