Aqueous dispersions, process for their production, and their use

The present invention relates to the production of aqueous dispersions that contain pyrogenically produced silicon dioxide, a process for their production, and the use of the dispersions for polishing semiconductor substrates. An aqueous dispersion containing a cerium oxide-doped, pyrogenically prod...

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Bibliographic Details
Main Authors Lortz, Wolfgang, Batz-Sohn, Christoph, Perlet, Gabriele, Will, Werner
Format Patent
LanguageEnglish
Published 16.12.2003
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Summary:The present invention relates to the production of aqueous dispersions that contain pyrogenically produced silicon dioxide, a process for their production, and the use of the dispersions for polishing semiconductor substrates. An aqueous dispersion containing a cerium oxide-doped, pyrogenically produced silicon dioxide, wherein the cerium oxide is introduced through an aerosol of a cerium salt solution or suspension and the average particle size in the dispersion is less than 100 nm. The dispersion is produced by dispersing the cerium oxide-doped, pyrogenically produced silicon dioxide in aqueous solution by means of a high energy input. The aqueous dispersion can be used for chemical-mechanical polishing.