Optoelectronic package with dam structure to provide fiber standoff
The present inventions relate generally to mechanisms for controlling the standoff distance between an optical fiber and a photonic device in an optoelectronic package. More particularly, a dam structure that defines the standoff distance between the photonic device and the optical fiber(s) is descr...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
02.12.2003
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Online Access | Get full text |
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Summary: | The present inventions relate generally to mechanisms for controlling the standoff distance between an optical fiber and a photonic device in an optoelectronic package. More particularly, a dam structure that defines the standoff distance between the photonic device and the optical fiber(s) is described.
An optoelectronic component is described that includes a photonic device carried by a base substrate. A dam structure is formed on the base substrate by dispensing and hardening a precise amount of a flowable material. The dam structure is sized to define a desired standoff between an optical fiber and an active facet on the photonic device. In embodiments where the photonic device is wire bonded to the base substrate, it may be desirable to provide a reverse wire bond in order to permit the optical fiber to be placed closer to the photonic device. In some embodiments, the base substrate takes the form of a flexible material having electrically conductive traces thereon that are electrically connected to the photonic device. An optical component support block may be provided to support the flex material. In some implementations, a semiconductor die may be directly soldered to the traces on the flexible material. |
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