Method of forming a capacitive element
1. Field of the Invention A method of forming a capacitive element for a circuit board or chip carrier having improved capacitance is provided. The element is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or mo...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
30.09.2003
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| Online Access | Get full text |
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| Summary: | 1. Field of the Invention
A method of forming a capacitive element for a circuit board or chip carrier having improved capacitance is provided. The element is formed from a pair of conductive sheets having a dielectric component laminated therebetween. The dielectric component is formed of two or more dielectric sheets, at least one of which can be partially cured followed by being fully cured. The lamination takes place by laminating a partially cured sheet to at least one other sheet of dielectric material and one of the conductive sheets. The total thickness of the two sheets of the dielectric component does not exceed about 4 rolls and preferably does not exceed about 3 mils; thus, the single dielectric sheet does not exceed about 2 mils and preferably does not exceed about 1.5 mils in thickness. |
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