Method of reforming reformable members of an electronic package and the resultant electronic package
The invention relates generally to electronic packages and more particularly to assemblies for connection of integrated circuit chips to chip carriers, chip carriers to printed circuit boards, modules to printed circuit cards, and the like. An electronic package includes a substrate having a contact...
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Main Author | |
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Format | Patent |
Language | English |
Published |
24.06.2003
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Online Access | Get full text |
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Abstract | The invention relates generally to electronic packages and more particularly to assemblies for connection of integrated circuit chips to chip carriers, chip carriers to printed circuit boards, modules to printed circuit cards, and the like.
An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member. |
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AbstractList | The invention relates generally to electronic packages and more particularly to assemblies for connection of integrated circuit chips to chip carriers, chip carriers to printed circuit boards, modules to printed circuit cards, and the like.
An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member. |
Author | Alcoe, David J |
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References | Queyssac (5714803) 19980200 Klein (6084781) 20000700 Kolman et al. (5531021) 19960700 Shaver (3517434) 19700600 Grigg (2002/0024136) 20020200 Ameen et al. (5744759) 19980400 Brofman et al. (6070321) 20000600 Agarwala et al. (5251806) 19931000 Pennisi et al. (5639416) 19970600 Rostoker et al. (5558271) 19960900 Tsukamoto (5640052) 19970600 Ference et al. (5244143) 19930900 Behun et al. (4914814) 19900400 Higashi et al. (6027791) 20000200 IBM Technical Disclosure Bulletin, vol. 20, Jul. 1997, pp. 545-546, "Cast Solder Preloading for Stacked Modules". Behun et al. (5060844) 19911000 Schmidt et al. (5148968) 19920900 Behun et al. (5147084) 19920900 Akram et al. (2002/0100973) 20020800 |
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Snippet | The invention relates generally to electronic packages and more particularly to assemblies for connection of integrated circuit chips to chip carriers, chip... |
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Title | Method of reforming reformable members of an electronic package and the resultant electronic package |
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