Method of reforming reformable members of an electronic package and the resultant electronic package
The invention relates generally to electronic packages and more particularly to assemblies for connection of integrated circuit chips to chip carriers, chip carriers to printed circuit boards, modules to printed circuit cards, and the like. An electronic package includes a substrate having a contact...
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| Format | Patent |
| Language | English |
| Published |
24.06.2003
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| Online Access | Get full text |
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| Summary: | The invention relates generally to electronic packages and more particularly to assemblies for connection of integrated circuit chips to chip carriers, chip carriers to printed circuit boards, modules to printed circuit cards, and the like.
An electronic package includes a substrate having a contact pad thereon, a reformable member such as a solder ball positioned on the contact pad, and an elastic member positioned around the reformable member. The elastic member exerts a girdling force on the reformable member so that when the reformable member is softened, the elastic member elongates the reformable member. This elongation accommodates thermal and other stresses between the foregoing substrate and another substrate joined at the free end of the reformable member. An apparatus is also provided for positioning the elastic member on and around the reformable member. |
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