Grounding of package substrates
The present invention relates to the field of semiconductor packages. More specifically, the invention relates to a method of providing grounding of a package substrate to dissipate static charge buildup during a step in the assembly of the package. An apparatus and method for dissipating static ele...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
20.05.2003
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| Online Access | Get full text |
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| Summary: | The present invention relates to the field of semiconductor packages. More specifically, the invention relates to a method of providing grounding of a package substrate to dissipate static charge buildup during a step in the assembly of the package.
An apparatus and method for dissipating static electrical charge following a manufacturing operation is disclosed. A semiconductor package is provided with ground pads that are located to assure electrical contact with ejection pins used to translate the package from one position to another. Static electricity builds up on the semiconductor package. The ejection pins provide the pathway for dissipating static electrical charge out of the semiconductor package. |
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