Bonding pad
1. Field of the Invention A wire bonding pad of a semiconductor integrated circuit device includes a first, test portion to which a probe tip may be contacted, and a second, wire bonding portion to which a wire is bonded for electrically connecting the bonding pad to a carrier or lead frame. Providi...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
13.05.2003
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| Online Access | Get full text |
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| Summary: | 1. Field of the Invention
A wire bonding pad of a semiconductor integrated circuit device includes a first, test portion to which a probe tip may be contacted, and a second, wire bonding portion to which a wire is bonded for electrically connecting the bonding pad to a carrier or lead frame. Providing a separate, test portion prevents the wire bonding portion from being damaged by a probe tip during testing. |
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