Multilayer ceramic electronic element and manufacturing method therefor

• Main Authors: Tokuoka, Yasumichi, Nomura, Takeshi
• Format: Patent
• Language: English
• Published: 22.04.2003

The present invention relates to a structure of multilayer electronic elements for use widely in electric products and a manufacturing method therefor, and more particular to a multilayer ceramic chip capacitor and a manufacturing method therefor. Internal electrode layers of a multilayer ceramic electronic element are structured such that spaces, which are formed between adjacent internal electrodes, are eliminated so as to substantially flatten the internal electrode layers. Moreover, the thickness of each green dielectric layer is reduced. To achieve this, a laminating process is performed by a thermal transfer printing method such that a thermal transfer conductor material and a thermal transfer dielectric material are used so as to form internal electrode portions and green dielectric portions. Thus, the internal electrode layers are formed.