Conductive adhesive and connection structure using the same

• Main Authors: Takezawa, Hiroaki, Kitae, Takashi, Ishimaru, Yukihiro, Mitani, Tsutomu
• Format: Patent
• Language: English
• Published: 18.02.2003

The present invention relates to a conductive adhesive used for solder-free mounting of electronic components and a structure connected by using the same. A mounting technique with improved adhesive strength and higher reliability against bending stress is provided with the use of a conductive adhesive including a binder resin and a metal filler as main components, in which a functional group is introduced into the molecular chain of the binder resin to form a multidentate bonding with an electrode metal easily. As a thermoplastic resin, at least two kinds of functional groups selected from the group consisting of a carbonyl group, a carboxyl group, an amino group, an imino group, an iminoacetic acid group, an iminopropionic acid group, a hydroxyl group, a thiol group, a pyridinium group, an imido group, an azo group, a nitrilo group; an ammonium group and an imidazole group are introduced. Accordingly, a strong bond with the electrode metal can be achieved. The conductive adhesive is screen-printed to an electrode disposed on a substrate, and after an electrode of a component is mounted, the structure is heated so as to create a mounted structure.