Fabrication method for semiconductor integrated circuit device
This invention relates to a technique for fabricating a semiconductor integrated circuit device; and, more particularly, the invention relates to a technique that is applicable to the fabrication of a semiconductor integrated circuit device, including the step of polishing a thin film formed on the...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
04.02.2003
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Online Access | Get full text |
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