Fabrication method for semiconductor integrated circuit device

This invention relates to a technique for fabricating a semiconductor integrated circuit device; and, more particularly, the invention relates to a technique that is applicable to the fabrication of a semiconductor integrated circuit device, including the step of polishing a thin film formed on the...

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Bibliographic Details
Main Authors Nakabayashi, Shinichi, Abe, Hisahiko, Ota, Katsuhiro
Format Patent
LanguageEnglish
Published 04.02.2003
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