Transmission equalization system and an integrated circuit package employing the same
The present invention is directed, in general to integrated circuit packaging, and, more specifically, to a transmission equalization system and an integrated circuit package employing the same. The present invention provides a transmission equalization system for use with an integrated circuit pack...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
17.12.2002
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| Online Access | Get full text |
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| Summary: | The present invention is directed, in general to integrated circuit packaging, and, more specifically, to a transmission equalization system and an integrated circuit package employing the same.
The present invention provides a transmission equalization system for use with an integrated circuit package employing a substrate. In one embodiment, the transmission equalization system includes a signal transmission subsystem having a pair of transmission line conductors located in the substrate and employing a differential electrical signal. The transmission equalization system also includes an equalization subsystem located proximate the pair of transmission line conductors that employs at least one aperture positioned and oriented to provide a substantially equivalent transmission environment for each of the pair of transmission line conductors. |
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