Component supplying method, component arrangement data forming method and electronic component mounting apparatus using the methods

The present invention relates to the provision of an efficient component mounting method for deciding the types of a variety of supplied components such as those purchased from two different corporations, which can be used in the objective mounting position for the improvement of mounting quality in...

Full description

Saved in:
Bibliographic Details
Main Authors Kuribayashi, Takeshi, Nonaka, Satoshi, Imafuku, Shigeki
Format Patent
LanguageEnglish
Published 12.11.2002
Online AccessGet full text

Cover

Loading…
More Information
Summary:The present invention relates to the provision of an efficient component mounting method for deciding the types of a variety of supplied components such as those purchased from two different corporations, which can be used in the objective mounting position for the improvement of mounting quality in an electronic component mounting apparatus for mounting electronic components of set, tray, stick, bulk and other types on a printed board and the apparatus of the method. High-speed high-reliability component supplying method and mounting method is obtained by checking whether or not a component is the regular component to be mounted through a component type detecting process by means of component arrangement data having a plurality of substitute component type names of components which can be mounted in the proper position of a component supply section and a detection section and a comparing and deciding process.