Fluid nozzle system and method in an emitted energy system for photolithography

This invention relates generally to the field of fluid dynamics and more particularly to a fluid nozzle system and method in an emitted energy system that may be used for photolithography production of semiconductor components. An emitted energy system for use in photolithography may include a fluid...

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Bibliographic Details
Main Authors Haas, Edwin G, Gutowski, Robert M, Calia, Vincent S
Format Patent
LanguageEnglish
Published 20.08.2002
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Summary:This invention relates generally to the field of fluid dynamics and more particularly to a fluid nozzle system and method in an emitted energy system that may be used for photolithography production of semiconductor components. An emitted energy system for use in photolithography may include a fluid nozzle. A nozzle and its method of manufacture are provided. A nozzle () may include a nozzle cavity () disposed within a nozzle body () between an up-stream end () and a down-stream end (). A nozzle passage () may be defined within the nozzle cavity () and extend a longitudinal length () from the down-stream end () of the nozzle body () into the nozzle cavity (). A discharge orifice () may also be defined at the down-stream end () of the nozzle cavity () and have an associated width (). The width () of the discharge orifice () may be substantially less than the longitudinal length () of the nozzle passage ().