Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof

1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or...

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Main Authors Jeon, Gi-young, Im, Eul-bin, Kim, Byeong Gon, Lee, Eun-ho
Format Patent
LanguageEnglish
Published 13.08.2002
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Abstract 1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.
AbstractList 1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.
Author Jeon, Gi-young
Kim, Byeong Gon
Lee, Eun-ho
Im, Eul-bin
Author_xml – sequence: 1
  fullname: Jeon, Gi-young
– sequence: 2
  fullname: Im, Eul-bin
– sequence: 3
  fullname: Kim, Byeong Gon
– sequence: 4
  fullname: Lee, Eun-ho
BookMark eNqNjEsKAjEQRLPQhb879AWEwe8BRHHpwr00k85kmCQ9dDqK4OGdAQ_g6kHVq5qbSeJEM_O58YsEItsSCHqsO2wIPD7b1ECbcgmoLKDvfkgJFXKbOkBVrD1ZUAYhFMhFHNYE7CAQWnCCkQCThYipDJUWGR8jqedh5kmI3dJMHYZMqx8XBi7n--m6LrlHpaT50QiOqA677ea4r7Z_KF8DOUpa
ContentType Patent
CorporateAuthor Fairchild Korea Semiconductor Ltd
CorporateAuthor_xml – name: Fairchild Korea Semiconductor Ltd
DBID EFH
DatabaseName USPTO Issued Patents
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EFH
  name: USPTO Issued Patents
  url: http://www.uspto.gov/patft/index.html
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
ExternalDocumentID 06432750
GroupedDBID EFH
ID FETCH-uspatents_grants_064327503
IEDL.DBID EFH
IngestDate Sun Mar 05 22:32:08 EST 2023
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-uspatents_grants_064327503
OpenAccessLink https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6432750
ParticipantIDs uspatents_grants_06432750
PatentNumber 6432750
PublicationCentury 2000
PublicationDate 20020813
PublicationDateYYYYMMDD 2002-08-13
PublicationDate_xml – month: 08
  year: 2002
  text: 20020813
  day: 13
PublicationDecade 2000
PublicationYear 2002
References Tsunoda (5466969) 19951100
Majumdar et al. (5703399) 19971200
Ishigami (5057906) 19911000
(0 774 782) 19970500
Bowman et al. (6083772) 20000700
Yoshida et al. (6313520) 20011100
Tsui et al. (6066890) 20000500
Sugawara et al. (6060772) 20000500
References_xml – year: 19951100
  ident: 5466969
  contributor:
    fullname: Tsunoda
– year: 20000500
  ident: 6066890
  contributor:
    fullname: Tsui et al.
– year: 20000700
  ident: 6083772
  contributor:
    fullname: Bowman et al.
– year: 19971200
  ident: 5703399
  contributor:
    fullname: Majumdar et al.
– year: 20000500
  ident: 6060772
  contributor:
    fullname: Sugawara et al.
– year: 19911000
  ident: 5057906
  contributor:
    fullname: Ishigami
– year: 20011100
  ident: 6313520
  contributor:
    fullname: Yoshida et al.
– year: 19970500
  ident: 0 774 782
Score 2.561261
Snippet 1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame,...
SourceID uspatents
SourceType Open Access Repository
Title Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
URI https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6432750
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1NSwMxEB3aIqgnRcX6xRy8RnfddndzlpZFUHpQ6K1kN0kPbZOym8WLP96ZrRQvek0gTBIyH-G9NwD3So7GZVUZIWWVilFplJBUNwg5jpKnLFWZNkxOfn1Li4_Ry3w870Gx58Js6BmJLdnSPLTNNvgOXEnufXfxYif-zBqBjtUHPt3aKz3T9pEiK0uV96GfRwztmkyLYzikJShlc6H5FTSmJ3Aw60ZPoWfcGXzNuCEZbrxu1wapVF2RDcgkebfEDhLO9S_ynyiyh0Sq4leoQmDJZY3BI-V3NTZtbVVl0Ftc0_2gZXQVKqdxo1zLPIWOeIi71tDI-Z3x9hxwOnl_LsTe1MWyZgjMIvrZUnIBA-eduQSUKqVDzzIrraFIrGVc5ZnSsbS5tGWcDGH45zJX_8xdw1HX5YSlXpMbGIS6NbcUbEN5153kN8qgjis
link.rule.ids 230,309,786,808,891,64394
linkProvider USPTO
linkToPdf http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV07T8MwED6VgnhMIECU5w2shpa0ST0DUXhVGUDqVjmx3aGtXeUhFn48dymqWGC1Jetsy_fdWfd9B3CtZH-Q5bkRUuah6GdGCUl5g5CDbnAXhSrShsnJb6Mw-eg_jwfjFiRrLsyCnpFYki3lTV0uK98UV5J7X128WIk_s0agY_WBTzf3Sqfa3hKyslT5BmwyxrKK_mOc7MEOLUJBm6vKX7AR78NW2oweQMu4Q_hKuSUZLryu5wYpWZ2RFcg0eTfFpiicM2DkX1FkH4mUx89QVRWLLmusPFKEV2BZF1blBr3FOd0QWq6vQuU0LpSrmanQUA9x1RwaOcIz3h4Bxo_v94lYmzqZFlwEM-n-bCo4hrbzzpwAShXSsUeRldYQFmvZy4eR0j1ph9JmvaADnT-XOf1n7gq204d48vo0ejmD3ablCeu-BufQroraXBDyVtllc6jf4mWRJQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Power+module+package+having+insulator+type+heat+sink+attached+to+rear+surface+of+lead+frame+and+manufacturing+method+thereof&rft.inventor=Jeon%2C+Gi-young&rft.inventor=Im%2C+Eul-bin&rft.inventor=Kim%2C+Byeong+Gon&rft.inventor=Lee%2C+Eun-ho&rft.number=6432750&rft.date=2002-08-13&rft.externalDBID=n%2Fa&rft.externalDocID=06432750