Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
13.08.2002
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Online Access | Get full text |
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Abstract | 1. Field of the Invention
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic. |
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AbstractList | 1. Field of the Invention
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic. |
Author | Jeon, Gi-young Kim, Byeong Gon Lee, Eun-ho Im, Eul-bin |
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CorporateAuthor | Fairchild Korea Semiconductor Ltd |
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References | Tsunoda (5466969) 19951100 Majumdar et al. (5703399) 19971200 Ishigami (5057906) 19911000 (0 774 782) 19970500 Bowman et al. (6083772) 20000700 Yoshida et al. (6313520) 20011100 Tsui et al. (6066890) 20000500 Sugawara et al. (6060772) 20000500 |
References_xml | – year: 19951100 ident: 5466969 contributor: fullname: Tsunoda – year: 20000500 ident: 6066890 contributor: fullname: Tsui et al. – year: 20000700 ident: 6083772 contributor: fullname: Bowman et al. – year: 19971200 ident: 5703399 contributor: fullname: Majumdar et al. – year: 20000500 ident: 6060772 contributor: fullname: Sugawara et al. – year: 19911000 ident: 5057906 contributor: fullname: Ishigami – year: 20011100 ident: 6313520 contributor: fullname: Yoshida et al. – year: 19970500 ident: 0 774 782 |
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Snippet | 1. Field of the Invention
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame,... |
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Title | Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof |
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