Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
13.08.2002
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Online Access | Get full text |
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Summary: | 1. Field of the Invention
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic. |
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