Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof

1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or...

Full description

Saved in:
Bibliographic Details
Main Authors Jeon, Gi-young, Im, Eul-bin, Kim, Byeong Gon, Lee, Eun-ho
Format Patent
LanguageEnglish
Published 13.08.2002
Online AccessGet full text

Cover

More Information
Summary:1. Field of the Invention A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and a manufacturing method thereof are provided. A general rectangular plate or pre-bent plate may be used as the heat sink. The heat sink may be attached during a sealing process or through a separate process performed after the sealing process. The power module package has an improved heat radiation characteristic.