Method and article for filling apertures in a high performance electronic substrate

1. Technical Field The present invention provides a method of filling an at least one aperture in a semiconductor substrate by placing a sacrificial carrier structure on a surface of the substrate, wherein the structure comprises, a first layer, a fill material over the first layer, and a mask over...

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Bibliographic Details
Main Authors Farquhar, Donald S, Papathomas, Konstantinos I
Format Patent
LanguageEnglish
Published 06.08.2002
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Summary:1. Technical Field The present invention provides a method of filling an at least one aperture in a semiconductor substrate by placing a sacrificial carrier structure on a surface of the substrate, wherein the structure comprises, a first layer, a fill material over the first layer, and a mask over fill material having at least one opening therein, such that the opening at least partially aligns with the aperture in the substrate. Thereafter, the fill material is forced into the aperture by the application of heat and pressure, and the sacrificial carrier structure is removed.