Method to build multi level structure

The invention relates to semiconductor devices. In particular, the invention relates to a multi-level metal structure and a process for forming the multi-level metal structure. A method for forming a structure. A first dielectric material is deposited on a substrate. The first dielectric material is...

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Bibliographic Details
Main Authors Uzoh, Cyprian E, Edelstein, Daniel C, Faltermeier, Cheryl, Locke, Peter S
Format Patent
LanguageEnglish
Published 02.07.2002
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