Semiconductor sealing epoxy resin composition and semiconductor device using the same

This application is a 371 of PCT/JP99/02978 filed Jun. 3, 1999. An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cau...

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Bibliographic Details
Main Authors Taniguchi, Takashi, Yamane, Minoru, Nishioka, Tsutomu, Harada, Tadaaki, Hosokawa, Toshitsugu, Ikemura, Kazuhiro, Misumi, Sadahito, Ohizumi, Shinichi
Format Patent
LanguageEnglish
Published 25.06.2002
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