Semiconductor sealing epoxy resin composition and semiconductor device using the same

This application is a 371 of PCT/JP99/02978 filed Jun. 3, 1999. An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cau...

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Main Authors Taniguchi, Takashi, Yamane, Minoru, Nishioka, Tsutomu, Harada, Tadaaki, Hosokawa, Toshitsugu, Ikemura, Kazuhiro, Misumi, Sadahito, Ohizumi, Shinichi
Format Patent
LanguageEnglish
Published 25.06.2002
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Summary:This application is a 371 of PCT/JP99/02978 filed Jun. 3, 1999. An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices:(X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P;(Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×10poise or lower; and(Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.