Manufacturing process of semiconductor devices
The present invention is relating to a manufacturing process of semiconductor devices, particularly to a manufacturing process of flip-chip-typed semiconductor devices, wherein the semiconductor devices have fuses connecting to the redundancy circuits. A manufacturing process of semiconductor device...
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| Main Authors | , |
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| Format | Patent |
| Language | English |
| Published |
28.05.2002
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| Online Access | Get full text |
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| Summary: | The present invention is relating to a manufacturing process of semiconductor devices, particularly to a manufacturing process of flip-chip-typed semiconductor devices, wherein the semiconductor devices have fuses connecting to the redundancy circuits.
A manufacturing process of semiconductor devices comprises providing at least a wafer, bumping the wafer, testing the wafer, laser repairing, and dicing. The step of testing one bumped wafer is contained after bumping and before laser repairing in order to shorten the procedures and increase throughput |
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