Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms

The invention relates generally to the thermal management for electronics equipment shelf/frame packaging and specifically to an apparatus for liquid cooling of electronic modules. An apparatus for providing liquid cooling to high power high capacity, switching, transport and processing equipment is...

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Bibliographic Details
Main Authors Vukovic, Aleksandar, Venus, Tim A, Rajala, Howard J, Cross, Douglas B, Leeuwen, Paul van, Roberts, Kim
Format Patent
LanguageEnglish
Published 28.05.2002
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Summary:The invention relates generally to the thermal management for electronics equipment shelf/frame packaging and specifically to an apparatus for liquid cooling of electronic modules. An apparatus for providing liquid cooling to high power high capacity, switching, transport and processing equipment is disclosed. The electronics of such equipment is typically contained in metal electronics modules, with the heat being directed to the walls of the modules. A pair of cooling plates with integral coolant flow through is pressed against the metal module walls with pressure. The cooling plates remain part of the shelf and the metal electronics modules can be removed for repair, exchange or upgrade.