Integrated circuit socket with contact pad
The present invention relates to an integrated circuit socket, and more particularly, to an integrated circuit socket with a contact pad. An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises the following components. (1) A base unit, consisting of a...
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| Main Authors | , , , , , |
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| Format | Patent |
| Language | English |
| Published |
07.05.2002
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| Online Access | Get full text |
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| Summary: | The present invention relates to an integrated circuit socket, and more particularly, to an integrated circuit socket with a contact pad.
An integrated circuit socket having a contact pad is disclosed. The integrated circuit socket comprises the following components. (1) A base unit, consisting of a base, contact pins and an elastomer. The contact pins will provide the electrical contact of the other elements, the elastomer provides the compactness of the assembly. (2) An interposer, comprising flexible film, a stiffener and a stop layer wherein the contact pad of the flexible film may contact with the solder ball of IC device to buffer the pressure formed by a tight contact when IC device is moving downward. The pressure will be dispersed with the flexible film such that the testing signals are transmitted. (3) An adapter unit, capable of positioning the integrated circuit device and includes a depressor to suppress or release the integrated circuit. (4) A cover unit is located over the base, the interposer and the adapter unit, and including a cover and a spring such that the cover is coupled to the depressor of the adapter unit and being capable of vertically moving up and down. |
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