Plasma chamber with erosion resistive securement screws

The present application pertains to plasma treatment chambers such as those used in semiconductor integrated circuit fabrication. An apparatus is provided for treating a wafer under fabrication with an erosive plasma, in a contamination controlled environment. The apparatus includes a chamber for co...

Full description

Saved in:
Bibliographic Details
Main Authors Lee, Ray C, Pang, Te-Hsun, Shu, Tonny, Lee, Birdson
Format Patent
LanguageEnglish
Published 30.04.2002
Online AccessGet full text

Cover

Be the first to leave a comment!
You must be logged in first